Centered around products from the leading manufacturer FUJI, we provide a variety of equipments that are essential for SMT line configulation. Counting the experience of its predecessor company Schmidt, First Technology has been in the leading edge of the Chinese electronics equipmet market for over 40 years. With our outstanding professional achievements in the Chinese market, we can recommend the best products not only from the world top brand, but also from Chinese manufacturers to customers looking to supply locally. more info
Specialising in semiconductor packaging and testing, we select the best equipments suited for our customer's situational needs. For power semiconductor device and power modules, we handle range of products, mainly wedge bonder and ribbon bonder from the market's leading brand Kulicke&Soffa. Our expertiese are unlimited to semicondutors, and we are absolutely confident in being able to provide the best equipments for related fields as well (advance package and optoelectronics as examples). more info
Basic Specification:
Micropunch system AMX [patented];
Large Sintering Area 350mm x 270mm
Sintering force Up to 980 Kn;
Controlled atmosphere full chamber (Nitrogen N2 or other) ;
Load cell force measurement for quality control;
Compact desing W1400 x D1600 x H1600 mm;
Full in line solution / carrier;
Proprietary software easy interface;
Customer tray;
Pass pass through option;
Automatic protective film feeding